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Batch Soldering Machines

 

Batch machine means that the assemblies are loaded and unloaded by hand. The solder cycle is done fully automatic
by the machine itself.

IBL offers economy and premium batch soldering solutions:

 
     
 

Minilab Features

  • Ideal for development, prototyping, rework and mini series production
  • Board sizes up to 300 x 275 x 80 mm
  • Table top unit
  • Low energy and fluid consumption with integrated heat exchanger
  • Easy operation, solder automatic
  • Maintenance-free transport system (patented)
  • Observation window into process chamber
  • 230 Volt operation
     
 

SV260 Economy Features

  • Optimized for laboratory operation, prototyping, rework and small series production
  • Board size up to 300 x 260 x 80 mm
  • Table top unit with easy front loading
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
  • Easy operation, solder automatic, program storage
  • Live temperature monitoring without high temperature profiler
  • Maintenance-free transport system (patented)
  • Observation window into process chamber
  • 230 Volt operation

 

     
 

SV540 Economy Features

  • Powerful unit for single and series production
  • Board sizes up to 560 x 360 x 80 mm
  • Small footprint
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
  • Touch panel for easy operation, solder automatic, program storage
  • Live temperature monitoring without high temperature profiler
  • Maintenance-free transport system (patented)
  • Integrated fluid filter system
  • Observation window into process chamber

 

sv540
     
 

SLC/BLC Premium Units Features

  • Powerful unit for highest demands
  • Different machine types with carrier size from 300 x 340 x 80 mm up to 840 x 540 x 80 mm
  • Small footprint
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
  • Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Wide variety of adjustable solder profiles
  • Lead-free and leaded soldering on one machine with one fluid
  • Live temperature monitoring with IBL Software (VP- Control) without profiler
  • Traceability and documentation with IBL Software (VP-Control) optionally with barcode function
  • Low maintenance due to Cool Handling (all moving parts outside process chamber)
  • Maintenance-free transport system (patented)
  • Integrated automatic fluid filter system
  • Observation window into process chamber
  • Optional patented Rapid Cooling System (RCS) for heat reduction of sensitive parts
  • Optional in-line handling (upgrade possible)
  • Different sizes are available on request

 

 

Inline Vapor Phase Reflow

 

IBL’s CX600/CX800 is fully automated inline vapor phase soldering solution. It provides precise, high quality results at medium to high volume throughput. The machines feature a standardized SMEMA interface for easy inline integration.

Features:

  • Vapor Phase Inline System for high volume throughput
  • A cycle time of under 20 sec. per board is possible
  • Carrier sizes from 680 x 650 x 80 mm up to 825 x 650 x 80 mm
  • Fully automatic inline operation
  • Two independent stations for loading and unloading of carriers
  • Loading and Unloading conveyors with buffer function
  • Three internal process chambers with automatic airlocks
  • Lowest energy and fluid consumption with Energy management system
  • Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Wide variety of adjustable solder profiles
  • Lead-free and leaded soldering on one machine with one fluid
  • Live temperature monitoring with IBL Software without profiler
  • Traceability and documentation with IBL Software
  • Low maintenance due to Cool Handling (all moving parts outside process chamber)
  • Maintenance-free transport system (patented)
  • Integrated automatic fluid filter system
  • Observation window into process chamber
  • Batch and inline operation available
  • Siemens Interface available

 

 

     
 

SLC / BLC Inline

Features:

  • Powerful unit for highest demands
  • Different machine types with carrier size from 300 x 340 x 80 mm up to 840 x 540 x 80 mm
  • Small footprint
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
  • Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Wide variety of adjustable solder profiles
  • Lead-free and leaded soldering on one machine with one fluid
  • Live temperature monitoring with IBL Software (VP- Control) without profiler
  • Traceability and documentation with IBL Software (VP-Control) optionally with barcode function
  • Low maintenance due to Cool Handling (all moving parts outside process chamber)
  • Maintenance-free transport system (patented)
  • Integrated automatic fluid filter system
  • Observation window into process chamber
  • Optional patented Rapid Cooling System (RCS) for heat reduction of sensitive parts
  • Different sizes are available on request

 

     
 

VAC645/665 Inline

Features:

  • Powerful unit for highest demands
  • Different machine types with carrier size from 300 x 340 x 80 mm up to 840 x 540 x 80 mm
  • Small footprint
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
  • Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Wide variety of adjustable solder profiles
  • Lead-free and leaded soldering on one machine with one fluid
  • Live temperature monitoring with IBL Software (VP- Control) without profiler
  • Traceability and documentation with IBL Software (VP-Control) optionally with barcode function
  • Low maintenance due to Cool Handling (all moving parts outside process chamber)
  • Maintenance-free transport system (patented)
  • Integrated automatic fluid filter system
  • Observation window into process chamber
  • Optional patented Rapid Cooling System (RCS) for heat reduction of sensitive parts
  • Different sizes are available on request

 

Vacuum Vapor Phase Machines

 

Vacuum soldering technology provides maximum solder quality for void-free soldering.

VAC645/665 Features

  • Powerful unit for highest demands
  • Different machine types with carrier size from 635 x 440 x 70 mm up to 635 x 640 x 70 mm
  • Small footprint
  • Vacuum system in the vapor (patented) with lower process temperature
  • Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
  • Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
  • Easy one step profile set-up with Intelligent profiling system (IPS)
  • Wide variety of adjustable solder profiles
  • Lead-free and leaded soldering on one machine with one fluid
  • Live temperature monitoring with IBL Software (VP- Control)
  • Traceability and documentation with IBL Software (VP-Control) optionally with barcode function
  • Maintenance-free transport system (patented)
  • Integrated automatic fluid filter system
  • Observation window into process chamber
  • Optional patented Rapid Cooling System (RCS) for heat reduction of sensitive parts
  • Optional in-line handling (upgrade possible)
  • Different sizes are available on request

 





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