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AOI, SPI, X-Ray systems and Software Solutions

 

 

VT-S500

Standard Inline 3D AOI for Post placement, 3D AOI for post Soldering

 

 

The VT-S500 is Omron's solution to providing next-generation, 3D inspection capability at minimal cost. With revolutionary 3D image processing, the VT-S500 accurately analyzes the topographical features of solder fillets to ensure PCB quality and reliability. This 3D technology is capable of performing solder inspections that mimic IPC guidelines more closely then ever before.

Advanced software capable of absorbing production inconsistencies and noise creates adaptable and stable inspection programs. By minimizing program teaching and tuning times, the VT-S500 greatly reduces the inspection costs traditionally associated with AOI.

With ultra-high-speed inspections and dual-lane availability, cycle times have been slashed and productivity has drastically increased.

The VT-S500 is available with camera magnifications of 15 or 20 microns and is capable of processing PCBs up to 460mm x 510mm (in single-lane applications) or 300mm x 510mm (in dual-lane applications).

 

 VT-S720

High-end Inline 3D AOI for Post placement, 3D AOI for post Soldering

 

Omron's VT-S720 is the next generation in AOI technology. With revolutionary 3D image processing, the VT-S720 accurately analyzes the topographical features of solder fillets to ensure PCB quality and reliability. This 3D technology is capable of performing solder inspections that mimic IPC guidelines more closely then ever before.

The VT-S270 was designed with an industry-first approach towards truly helping users cut inspection costs and optimize their investment in quality by drastically reducing teaching times and eliminating the need for program tuning by production time.

True color image processing and advanced software capable of absorbing production inconsistencies and noise, creates new levels of adaptability and stability of inspection programs. The VT-S720 represents Omron's current pinnacle of PCB inspection quality and capability.

The VT-S720 is available with camera magnifications of 15 or 20 microns and is capable of processing PCBs up to 460mm x 510mm.

 

 

VT-RNS2 ptH

Standard desktop type 2D AOI for Post Soldering

 

Designed for off-line inspection, the VT-RNSII-ptH is an ideal solution for smaller manufacturers running low volume or prototyping assembly lines. The inspection algorithms used in the VT-RNSII-ptH are identical to the fully automated in-line machine, the VT-RNSII.

The system uses Omron’s patented three colour highlight system which has proven so successful. This lighting system illuminates the target from all angles and in all directions in a 360 degrees dome (dome illumination).  The advantage of dome illumination is that it enables stable performance of inspection regardless of component placement directions or other angle designs.  In high-density placement applications, the reflective luminosity of the solder surface is diminished by the shadows of adjacent components.

Features include:
  • Simple operation
  • Patented 3 Colour highlight technology
  • High resolution inspection
  • Easy programming with automatic teaching
  • User friendly installation
  • Statistical analysis
  • CAD import
  • OCV function
 

 

 

 

VP6000-V

 3D Inline Paste Inspection System (Post Printing)

 

With VP series full 3D paste inspection of all pads is reality: it is designed to offer high-speed, high precision 3D inspection inline with maximum throughput. The 3CCD camera is placed vertically to the solder, and the projector radiates a colored stripe light pattern and an anlge above the object. The amount of the deviation of the projected stripe pattern from the object is converted into the height, according to the triangulation principle. Because the solder printed on the substrate is measured in the plane, the inspection speed it fast. The color stripe phase shifting is adopted to create 3D images by projecting RGB patterned light.

Features:
  • High speed 100% analysis of solder paste
  • Accurate 3D volume inspection technology
  • Simple conversion of Gerber data for easy programming
  • Off-line programming and data analysis
  • 2D code reading (option)
Measurement Principle of VP Series: The CCD camera is placed vertically to the solder and the projector radiates a colored stripe light pattern at an angle above the object. The amount of the deviation of the projected stripe pattern from the object, is converted into the height according to the triangulation principle. Because the solder printed on the substrate is measured in the same plane, the inspection speed is fast. The color stripe phase shifting is adopted to create 3D images by projecting RGB patterned light. 

 

 

 

VT-X700

 3D AXI Post Soldering

 

Omron use high definition CT reconstruction images to inspect a wide variety of component types from BGA to chip. By using 3D reconstruction, automatic defect analysis is extremely accurate and fast with a BGA inspected in less than 5 seconds. PCB warp compensation is also performed for each solder joint, ensuring that the slice level is automatically detected correctly.The VT-X700 uses a closed x-ray tube keeping maintenance to a minimum; an important feature for in-line x-ray required to operate without stops.

Features:

  • High-precision X-Ray CT imaging: Angle 3DCT imaging and inspection algorithms allow fast and accurate automated inspection
  • High speed inspection based on efficient x-ray inspection techniques
  • User friendly GUI allows visual inspection of all items
  • Automatic Component Creation
  • Automatic Warp PCB Compensation
  • Real Time proces improvement (Option)
 

 

 

Omron Q-upNAVI system - a true process improvement tool

 

 

Q-upNAVI is designed to enhance the manufacturing process by identifying the likely cause of defects from data collected at various stages of the production process and suggesting correction for each defect.

Q-upNAVI offers predictive inspection at each stage in PCB production, it checks the success of each process, pulls up defects and even suggests possible diagnoses. This means that specific processes can be individually checked, defects flagged up and then dynamically adjusted and refined during the manufacturing cycle - minimising waste at the end of the process.

 

 

 





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