BTU's Pyramax™ family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging.
Pyramax™ reflow ovens provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU's exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry.
With 6, 8, 10 and new 12-zone air or nitrogen models, 350C maximum temperature and a comprehensive menu of options, Pyramax™ reflow ovens are the industry's most versatile performers and best value. The Pyramax features BTU's proprietary WINCON™ control system. WINCON features a simplified user interface and incredibly powerful analytical capabilities.
Dynamo is the newest reflow oven platform designed specifically for processing consumer electronics.
Get the repeatability and thermal performance you expect from the world leader. Dynamo's simplified configuration delivers 24/7, with high uptime and reduced cost of ownership. With 8, 10, and 12 zone air or nitrogen models available. Backed by BTU's unparalleled worldwide service and applications team, the Dynamo reflow oven is a value-driven workhorse.
New Convection Design delivers high efficiency through innovative thermal transfer. This allows for excellent temperature and gas flow uniformity across the reflow oven chamber.