VT-S1080
Automated Optical Inspection
A VT-S1080 a világ egyik legfejlettebb 3D AOI rendszere, amelyet a magas minőségi elvárásokat támasztó gyártási környezetek számára fejlesztettek ki. Az új technológiák hatékonyan kiküszöbölik az árnyékolásból, tükröződésből és hosszú ciklusidőből adódó, hagyományos nehezítő problémákat.
A rendszer lehetővé teszi a felügyelet nélküli, automatizált ellenőrzést, miközben prediktív (előrejelző) megoldásainak köszönhetően csökkenti az élőmunka-igényt és növeli a termelékenységet.
| Type | VT-S1080-V2.0 | VT-S1040-V2.0 | VT-Z600-V2.0 |
|---|---|---|---|
| Outer dimensions | 1180(W) x 1450(D) x 1500(H)mm (excluding tower lamp and monitor) | ||
| Weight | Approx. 1240Kg | ||
| Power supply | 200 to 240 V AC (Single phase); Voltage fluctuation range ±10% 50/60Hz | ||
| Rated power | 2.0 kVA (Maximum current 10 A) | ||
| Line height | 900±20mm | ||
| Air supply | Not required | ||
| Operating temperature range | 10~35°C | ||
| Operating humidity range | 35 to 80% RH (Non-condensing) | ||
| Camera | Direct: 25Mpix | Direct: 25Mpix | Direct: 25Mpix |
| Oblique: 5Mpix | Oblique: — | Oblique: — | |
| Resolution | Direct: 12.5µm | Direct: 12.5µm | Direct: 12.5µm |
| Oblique: 10µm | Oblique: — | Oblique: — | |
| FOV | Direct: 52.5 x 52.5mm | Direct: 52.5 x 52.5mm | Direct: 52.5 x 52.5mm |
| Oblique: 25.9 x 19.4mm | Oblique: — | Oblique: — | |
| Inspection principle | Hybrid 3DShape reconstruction MDMC*12 illumination + Phase shift (MPS*13) | Hybrid 3DShape reconstruction MDMC*12 illumination + Phase shift (MPS*13*14) | 2.5D Shape reconstruction MDMC*12 illumination |
| Supported PCB size | Size: Single lane: 50(W) x 50(D) ~ 510(W) x 680(D)mm Dual lane: 50(W) x 50(D) ~ 510(W) x 330(D)mm | ||
| Thickness: 0.4~4mm | |||
| Weight: 4Kg | |||
| Clearance | Clearance on PCB: 50mm from board surface Clearance under PCB: 50mm from the back of the board (including PCB warpage, deflection, component tolerance, etc.) | ||
| Height measurement range | 25.4mm | 25.4mm | — |
| Inspection item | Component height, lift, tilt, missing or wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle | Missing or wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle | |