Pyramax
Vacuum Reflow Oven
The Pyramax Vacuum reflow oven has been designed for inline processing of PCB assemblies or products that require low solder voiding for critical performance applications. Heat dissipation applications such as thermal pads on SMT components can benefit from vacuum processing resulting in reduced solder voids, improved thermal transfer and increased yield. The system has been designed with the requirements of large EMS, OEMs and high-volume automotive segments in mind. Processing temperatures of up to 350°C can be achieved with vacuum levels as low as 1 Torr. Integrated controls and fully automatic vacuum opera- tion is achieved via BTU’s proprietary WINCON™, Windows™-based control system. The system has a maximum processing width of up to 457 x 457 mm (18 x 18 inches).
| Model | Pyramax125N | |
|---|---|---|
| Specification | Value | Unit / Notes |
| Process Chamber Temperature Rating | 350 | °C |
| Vacuum Chamber Temperature Rating | 300 | °C |
| Convection Heated Zones | 10 | top and bottom |
| Vacuum Chamber Internal | 1 | top radiant panel heater |
| Vacuum Chamber Heat Assist | 2 | heated convection zones |
| Conveyor System | edge rail support | |
| Vacuum Chamber Zones | 1 | zone |
| Vacuum Chamber Size | up to 457 x 457 | mm (18 x 18 inches) PCB |
| Vacuum Level | 20 (1 optional) | Torr |
| Pump Down Time | 15-20 | seconds (typical) |
| Hold Time | 10-60 | seconds |
| Refill Time | 15 | seconds (typical) |
| Atmosphere | nitrogen / air | |
| * All specifications are subject to change without notice | ||