Rapid Pro
Ball Bonder
RAPID™ Pro introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.
RAPID™ Pro is the first K&S GEN-S Series Automatic Bonder engineered to enable Industry 4.0 communication and is RoHS compliant.
| TECHNICAL SPECIFICATIONS | |
|---|---|
| WIRE BONDING CAPABILITY | |
| Ultra Fine Pitch | 35 µm inline bond pad pitch |
| Wire Size | 0.6 mil to 2.5 mil copper, silver, or gold wire (heavy wire kit needed for wire diameter > 2.0 mil) |
| Bonding Area | X Axis: 56 mm Y Axis: 80 mm (Standard), 87 mm (LA), 90 mm (ELA) |
| Total Bond Placement Accuracy | 2.0 µm @ 3 sigma |
| Pattern Recognition / Optics / Vision | Higher Resolution Progressive Scan Vision System CCD Camera • Dual Magnification Optics (standard: 2x & 6x) • Optional Programmable Focus for High Magnification |
| Premium Processes | New – ProCu-6 and ProAu-2 Pro Series – ProBond, ProStitch PLUS, ProLoop, and ProCu SSB |
| Program Compatibility | Compatible with all standard processes from existing models. Programs are NOT backwards compatible. Programs taught on a new bonder model will not run on an older bonder. |
| LOOPING CAPABILITY | |
| Maximum Wire Length | 7.6 mm with 1.0 mil wire 3.0 mm with 0.6 mil wire |
| Minimum Loop Height | Ultra-low loop with Power Series Low Loop 40 µm with 0.6 mil wire |
| Wire Sway | Wire length < 2.54 mm: 25 µm @ 3 sigma Wire length > 2.54 mm: ± 1% wire length @ 3 sigma |
| SET UP & CONVERSION TIMES | |
| Same Leadframe Type | < 4 min Heat block insert & clamp changes, program load from disk |
| Different Leadframe Type | < 8 min Leadframe width & length changes, magazine size change, heat block insert & clamp change, program load from disk |
| KNET PLUS ASSEMBLY EQUIPMENT NETWORK | |
| KNet PLUS improves efficiency and productivity by monitoring equipment status in real-time. It collects data and controls process programs locally or from anywhere on a customer’s network. Contact your K&S Sales Representative to learn more. | |
| MATERIAL HANDLING CAPABILITY | |
| Package / Leadframe Dimensions | Length: 90–300 mm (L/F shorter than 100 mm requires optional injector kit and short magazine kit) Width: 15–92 mm (Standard), 15–95 mm (LA), 25–100 mm (ELA) Thickness: 0.10–11 mm Die Pad Downset: Up to 2.3 mm |
| Magazine Dimensions | Width: 20–110 mm Length: 127–305 mm Height: 50–178 mm Slot Pitch: 1.27–25 mm Max Weight: 5.22 kg |
| MAN-MACHINE INTERFACE | |
| Monitor | 21.5" color LCD display |
| Control Panel | Function keys and dedicated buttons, user-friendly mouse |
| User Interface | Simple pull-down menus. Color-overlays of wire groups for easy programming and teach. |
| FACILITY REQUIREMENTS | |
| Minimum Air Pressure | 3.52 kg/sq cm (50 psi) |
| Nominal Air Consumption | 185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi) |
| Cover Gas Consumption (Cu & Ag) | Minimum 0.6 liters/min Maximum 1.5 liters/min Nominal 1.1 liters/min |
| Input Voltage | Standard: 200–240 VAC (−15% to +10%), Single Phase 50/60 Hz (±3 Hz) Optional: 100–115 VAC (−15% to +10%), Single Phase 50/60 Hz (±3 Hz) |
| Power Consumption | 1.5 kVA (nominal), 2.6 kVA (max.) |
| Footprint | Base machine with MHS: 889 mm wide x 1009 mm deep (35” x 39.7”) |
| Weight (estimated) | Machine: 590 kg (1300 lbs) Machine & Crate: 670 kg (1477 lbs) |