VT-S1080
Automated Optical Inspection
The technological evolution of the market has made manufacturing demands more complex and diverse, with higher quality requirements. In parallel, labor shortages are only adding to these challenges.
There is an urgent need to not only purchase new manufacturing equipment and improve performance, but also develop and train a skilled workforce able to support production.
| Type | VT-S1080-V2.0 | VT-S1040-V2.0 | VT-Z600-V2.0 |
|---|---|---|---|
| Outer dimensions | 1180(W) x 1450(D) x 1500(H)mm (excluding tower lamp and monitor) | ||
| Weight | Approx. 1240Kg | ||
| Power supply | 200 to 240 V AC (Single phase); Voltage fluctuation range ±10% 50/60Hz | ||
| Rated power | 2.0 kVA (Maximum current 10 A) | ||
| Line height | 900±20mm | ||
| Air supply | Not required | ||
| Operating temperature range | 10~35°C | ||
| Operating humidity range | 35 to 80% RH (Non-condensing) | ||
| Camera | Direct: 25Mpix | Direct: 25Mpix | Direct: 25Mpix |
| Oblique: 5Mpix | Oblique: — | Oblique: — | |
| Resolution | Direct: 12.5µm | Direct: 12.5µm | Direct: 12.5µm |
| Oblique: 10µm | Oblique: — | Oblique: — | |
| FOV | Direct: 52.5 x 52.5mm | Direct: 52.5 x 52.5mm | Direct: 52.5 x 52.5mm |
| Oblique: 25.9 x 19.4mm | Oblique: — | Oblique: — | |
| Inspection principle | Hybrid 3DShape reconstruction MDMC*12 illumination + Phase shift (MPS*13) | Hybrid 3DShape reconstruction MDMC*12 illumination + Phase shift (MPS*13*14) | 2.5D Shape reconstruction MDMC*12 illumination |
| Supported PCB size | Size: Single lane: 50(W) x 50(D) ~ 510(W) x 680(D)mm Dual lane: 50(W) x 50(D) ~ 510(W) x 330(D)mm | ||
| Thickness: 0.4~4mm | |||
| Weight: 4Kg | |||
| Clearance | Clearance on PCB: 50mm from board surface Clearance under PCB: 50mm from the back of the board (including PCB warpage, deflection, component tolerance, etc.) | ||
| Height measurement range | 25.4mm | 25.4mm | — |
| Inspection item | Component height, lift, tilt, missing or wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle | Missing or wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle | |